tapeout_checklist.md

Project Management	Answer
Was git used for source control?
Were all sources under version control?
Were tapeout reports saved in src tree?
Was tapeout db archived and tagged?

Specification	Answer
Is there a written specification?
Is the datasheet complete and accurate?
Is there a user guide?
What is the chip max power target?
What is the chip standby power target?
What is the chip yield target?
What is the chip cost target?
What is the max die size?
What is the maximum die size?
How many signal IOs?
What is the highest frequency IO?

Design	Answer
In Verilog 2005 used?
Are all features implemented?
Are all issues closed?
Has design been through peer review?
Has a linter been run?
Is there zero use of 'casex'?
Were Latches used? (If so list)
Were negedge flops used? (If so list)
Do all blocks have a license header?
Are all interface signals described?
Was naming methodology followed?
Lower case for all signals?
Upper case for parameters/defines?
Max 80 character line lengths?
Case or and/or style muxes used?
Non-blocking used for all states?
Was instantiation by name used?
Does each file contain one module
Is HDL reuse maximized?
Has design been through peer review?
Are all signals connected?
Any floating inputs in design?
All power-gated signals isolated?
All voltage domain crossings levelshifted?
Is Verilog 2005 used?

Verification	Answer
100% HDL Code Coverage?
100% Unit Test Covergage?
Random verifiation used?
>24hrs of random vectors?
Randomized clock frequencies?
Were all open issues closed?

| Were all features tested? | | | Simulator support for all features? | | | Was design emulated in an FPGA? | | | Was design validated with application SW? | | | Was formal equivalence run between HDL/GL? | | | Is the firmware written? | | | Is there a demo? | |

Timing	Answer
All paths constrained?
All clocks defined?
Max transition defined?
Hold margin added?
False paths reviewed/proven?
Setup time met?
Hold time met?
All paths constrained?
Was clock path pessimism removed?
Was vmin/vmax verified?
Was Tmin/Tmax verified?
Was FF/SS/TT verified?
On chip variability accounted for?
What other corners/modes were verified?

Clock	Answer
Percentage regs clock gated?
Integrated clock gating cells used?
Setup/hold verified on clock gating cells?
Clock tree insertion delay?
Clock tree local skew?
Clock tree global skew?
Clock tree manually reviewed?
Double pitch/shield on main branch?
List of all clock domain crossings?
Use of oh_fifo_cdc on all CDCs?
Were custom CDCs used? (if so list)

Reset	Answer
Is reset active low used?
Is reset of type async entry, sync exit?
Are all reset pins synchronized?
Was oh_rsync used for every clk domain
Is use of reset minimized?
Total fanout of reset signal?

Power	Answer
Is a power mesh used?
What is the simulated IR drop?
Was dynamic IR drop analysis run?
Were package parasitics simulated?
Does chip follow IP/foundry guidelines?
Standby power goal validated in simulation?
Peak power goal validated in simulation?

IO	Answer
Were ESD guidelines followed?
Were IO layout guidelines followed?
Was the IO reviewed by package team?
Are there sufficient power/gnd bumps
Can assembly team meet pitch requirements?
What packaging style will be used?
Wirebond pad/pitch (if any)?
Flip-chip pad/pitch(if any)?

IP
Is all external IP silicon proven?
Are IP characterization reports available?
Is the latest version IP being used?
Was the IP verilog model used for DV?
Wast the IP simulated in full-chip env?
Did you read all the documents?
Are there any open document questions?
Are all IP design checklists met?

Synthesis	Answer
Was the correct/latest version of HDL used?
Are all EDA warnings/errors acceptable?
The number of warnings has bee minimized?

Layout	Answer
Synthesis/PNR	Answer
--------------------------------------------	--------------------------------
Is the flow completely automated?
Was the correct/latest version of HDL used?
Are all EDA warnings/errors acceptable?
The number of warnings has bee minimized?
Was the correct/latest gate level used?
Are all EDA warnings/errors understood?
Are ECO/spare cells used?
Were boundary cells included?
Were decoupling caps used?
How many placed instances?
What is the logic utilization?
Is block DRC clean?
List any DRC violations?
Is block LVS clean?
List any LVS violations?
Were the final foundry masks reviewed?
Were the minimal number of metals used?
Is the chip ring included
Is the chip logo included
Have gds layer map been manually reviewed?
Has tapeout GDS been manually reviewed?
XOR check between foundry/design GDSIIs

DFM	Answer
Were all foundry DFM guidlines followed?
Is column repair included in SRAM?
What is the percentage of double vias?
Is yield optimizing wire spreading used?
Does design include fault tolerance?
Does design meet metal density rules?

Test	Answer
Does design use standard scan DFT?
What is the scan coverage?
What is the PPM defect ratio target?
Are ATPG vectors generated?
What fault models are used for vectors?
What are the end user quality requirements?
Are test ports controllable from pins?
What is the estimated test time?
Can all IO pins be tested for opens/short?
Does chip include temp sensor?

Circuit Checks	Answer
Does design pass Signal Integrity checks?
Does gate level design boot out of reset?
Does design meeet Electromigration rules?
Does design meet antenna rules?
Are metastability requirement met?
Are soft error rate requirements met?
Are on-chip decoupling caps sufficient?
Are on-package decoupling caps sufficient?
Are RC delays minimized?
Are all latchup requirements met?
Design's lowest operating voltage?
What is the longest signal on the chip?
Is design sensitive to duty cycle shift?
What is the max duty-cycle distortion?
Does design meet EMI constraints?
ERC runset checks run on GDSII?