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title layout permalink product shortname archived dateAdded ai_board ai_board_desc description keywords display_product product_short_desc product_specification product_images sticky_tab_bar product_buy_links product_bottom_section vendor attributes
Qualcomm® Robotics RB1 Development Platform
product
/product/qualcomm-robotics-rb1/
true
qualcomm-robotics-rb1
false
2023-09-16 09:00:00 +0000
true
Qualcomm® Robotics RB1 Development Kit is based on the Qualcomm® QRB2210 Robotics SoC.
The Qualcomm® Robotics RB1 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.<br> The Qualcomm Robotics RB1 platform is powered by Qualcomm® QRB2210 Robotics SoC, and it integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers the flexibility to design and create a generation of high-performance everyday robotics and IoT products. The Qualcomm Robotics RB1 combines heterogeneous compute and AI focused performance, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.<br> Built on the Qualcomm Robotics RB1 and Qualcomm Robotics RB2 platforms, the kits are ideal for OEMs, ODMs, and IoT developers. In a cost-effective package, they combine the computing, camera features, artificial intelligence and connectivity you need to take mass-market robotics and IoT products to consumers.<br> There are three options to purchase the Qualcomm® Robotics RB1 Development Kit. The Core Kit includes just the mainboard and the QRB2210 SoM, whereas the Vision Kit includes the Vision Mezzanine and Camera Modules, and the Full Kit includes a display panel in addition.<br>
processing, power, Wi-Fi, Bluetooth connectivity, GPS, development, board, mid-tier, Qualcomm, QRB2210, SoC, SoM, processor, low cost, Product, Development, Platform
true
Qualcomm® Robotics RB1 Development Kit is based on the Qualcomm® QRB2210 Robotics SoC
ce
images/rb1-front-sd.png
images/rb1-back-sd.png
title url active
Qualcomm® Robotics RB1 Development Platform
/product/qualcomm-robotics-rb1/
true
title url tab_position
Documentation
/documentation/consumer/dragonboard/qualcomm-robotics-rb1/
1
title url tab_position tab_align_right
Support
2
true
link-title link-url from type link-price link-price-currency product_sidebar_sections
Qualcomm® Robotics RB1 Core Kit
Thundercomm
board
$199.00
USD
title icon items
OS
icon-terminal
title link
All Downloads
/documentation/consumer/dragonboard/qualcomm-robotics-rb1/downloads/
title url items
Accessories
/products/accessories/
title link
Power
/product/power/
title link
Adapter
/product/adapter/
title link
Debug
/product/debug/
title link
Misc
/product/misc/
title url items
Mezzanine
/products/mezzanine/
title link
UART Serial
/product/uartserial/
title link
Sensors Mezzanine
/product/sensors-mezzanine/
title link
Audio Mezzanine
/product/audio-mezzanine/
title items
Kits
title link
Qualcomm Robotics RB1 development kit
name value
SoC
Qualcomm® QRB2210
name value
CPU
Quad-core Qualcomm® Kryo™ 260 at up to 2.02 GHz
name value
GPU
Qualcomm® Adreno™ 702 GPU @ 845 MHz with support for Open GL ES 3.1, Open CL 2.0, Vulkan 1.1
name value
RAM
2 GB LPDDR4X SDRAM designed for 1804 MHz clock, dual-channel non-PoP high-speed memory
name value
Storage
Kingston EMMC16G-TB29 eMMC 5.1 16 GB, 1x MicroSD card slot
name value
Ethernet
Asix AX88179AQF 1Gb Ethernet over USB 3.0
name value
Wireless
WCN3950 WLAN 1 × 1 802.11a/b/g/n/ac
name value
USB
1x USB 2.0 Micro B (Debug only), 1x USB 3.0 Type C (Host or device mode), 2x USB 3.0 Type A (Host mode only) Genesys GL3590 USB 3.1 Gen 2 10 Gb four port hub controller
name value
Display
One 4-lane DSI D-PHY 1.2 at 1.5 Gbps, HDMI Type A
name value
Video
Video decode : 1080p30 8-bit decode for H.264/H.265 Video encode : 1080p30 8-bit encode for H.264/H.265
name value
Audio
Analog : Integrated WCD9370 audio codec and SoundWire interface Voice : Integrated low power island (LPI) for voice UI
name value
Camera
Performance : 2x ISP (13 MP + 13 MP or 25 MP) at 30 fps ZSL Interface : Two 4-lane CSIs (4/4 or 4/2/1) D-PHY 1.2 at 2.5 Gbps per lane or C-PHY 1.0 at 10 Gbps (3.42 Gbps/trio)
name value
Sensors
Accelerometer + Gyro Sensor
name value
Expansion Interface
HS1: 96boards 60 pin High-Speed connector (4L-MIPI DSI, USB 2.0, 2L+4L-MIPI CSI) HS2: 60 pin High-Speed connector (4L-MIPI CSI x 2) LS1: 96boards 40 pin Low-Speed connector (UART x2, SPI, I2S, I2C x2, GPIO x12, DC power) LS2: 46 pin Low-Speed connector (headset, stereospeaker, DMIC I/F x3, CAN, I2S, GPIOs) LS3: 46 pin Low-Speed connector
name value
Buttons
Power, Volume Up/Down, Force Usb Boot, 2x DIP switches (6 PIN)
name value
Power
12V adapter with a DC plug Plug specification is inner diameter 1.75mm and outer diameter 4.75mm
name values
OS Support
LE build from Linaro LU build from Thundercomm
 
The Qualcomm® Robotics RB1 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.

The Qualcomm Robotics RB1 platform is powered by Qualcomm® QRB2210 Robotics SoC, and it integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers the flexibility to design and create a generation of high-performance everyday robotics and IoT products. The Qualcomm Robotics RB1 combines heterogeneous compute and AI focused performance, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.

Built on the Qualcomm Robotics RB1 and Qualcomm Robotics RB2 platforms, the kits are ideal for OEMs, ODMs, and IoT developers. In a cost-effective package, they combine the computing, camera features, artificial intelligence and connectivity you need to take mass-market robotics and IoT products to consumers.

There are three options to purchase the Qualcomm® Robotics RB1 Development Kit. The Core Kit includes just the mainboard and the QRB2210 SoM, whereas the Vision Kit includes the Vision Mezzanine and Camera Modules, and the Full Kit includes a display panel in addition.

The Qualcomm® Robotics RB2 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.

Additional Information

Component Description
SoC Qualcomm® QRB2210
CPU Quad-core Qualcomm® Kryo™ 260 at up to 2.02 GHz
GPU Qualcomm® Adreno™ 702 GPU @ 845 MHz with support for Open GL ES 3.1, Open CL 2.0, Vulkan 1.1
RAM 2 GB LPDDR4X SDRAM designed for 1804 MHz clock, dual-channel non-PoP high-speed memory
Storage Kingston EMMC16G-TB29 eMMC 5.1 16 GB, 1x MicroSD card slot
Ethernet Asix AX88179AQF 1Gb Ethernet over USB 3.0
Wireless WCN3950
WLAN 1 × 1 802.11a/b/g/n/ac
USB 1x USB 2.0 Micro B (Debug only),
1x USB 3.0 Type C (Host or device mode),
2x USB 3.0 Type A (Host mode only)
Display One 4-lane DSI D-PHY 1.2 at 1.5 Gbps, HDMI Type A
Video 1080p60 8-bit decode for H.264/H.265
1080p60 8-bit encode for H.264/H.265V
Audio Analog : Integrated WCD9370 audio codec and SoundWire interface
Voice : Integrated low power island (LPI) for voice UI
Camera Performance : 2x ISP (13 MP + 13 MP or 25 MP) at 30 fps ZSL
Two 4-lane CSIs (4/4 or 4/2/1) D-PHY 1.2 at 2.5 Gbps per lane or C-PHY 1.0 at 10 Gbps (3.42 Gbps/trio)
Sensors Accelerometer + Gyro Senso
Expansion Interface HS1: 96boards 60 pin High-Speed connector (4L-MIPI DSI, USB 2.0, 2L+4L-MIPI CSI)
HS2: 60 pin High-Speed connector (4L-MIPI CSI x 2)
LS1: 96boards 40 pin Low-Speed connector (UART x2, SPI, I2S, I2C x2, GPIO x12, DC power)
LS2: 46 pin Low-Speed connector (headset, stereospeaker, DMIC I/F x3, CAN, I2S, GPIOs)
LS3: 46 pin Low-Speed connector
Button Power, Volume Up/Down, Force Usb Boot, 2x DIP switches (6 PIN)
Power Source 12V adapter with a DC plug
Plug specification is inner diameter 1.75mm and outer diameter 4.75mm
OS Support LE build from Linaro,
LU build from Thundercomm
Size 85mm by 54 mm meeting 96Boards™ Consumer Edition Standard form dimensions specifications
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